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Каталог Thermaltake
Patent Information
Country Patent No.
Taiwan
M 313809

Embedded QUAD Heatpipe greatly increase thermal dissipation.
Contemporary black coating with all aluminum material, combines aesthetic appeal
 
with ultimate performance in notebook cooling.
Ultra slim design for ultimate comfort.
Supports all notebook up to 15" In screen size.




Heatpipe Cooling Solution :
 
Detail features :
Thermaltake serigraphy
Embedded QUAD Heatpipe for thermal dissipation
Large number of aluminum fins
Skid-proof pad
Bevel cutting for ergonomic design
All aluminum material
 
Cooling System
 
Appearance
(a) Thermaltake serigraphy
(b) Aluminum material
(c) Aluminum fin
(d) Heatpipe X 4
(e) Skid-proof pad